Product Details
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Transcend MTE370T - SSD - 256 GB - internal - M.2 2230 - PCIe 3.0 x4 (NVMe)
The Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
What's in the Box:
The Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃.
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for better performance
- NCQ command for better performance
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Single-sided to fit perfectly in small form factor devices
- Space-saving M.2 form factor (30 mm) - ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Anti-sulfur technology implemented to prevent sulfurization in the environment
- Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
- Promised operational reliability in an extended temperature range (from -20°C to 75°C)
What's in the Box:
- Transcend MTE370T - solid state drive
- Software
